Semiconductor integrated circuit device allowing change of product specification and chip screening method therewith

ABSTRACT

A semiconductor integrated circuit device capable of changing the product specification. The semiconductor integrated circuit device comprises an integrated circuit section containing a first circuit section having a first function and a second circuit section having a second function, and active signal generator means for producing an active signal for activating the first circuit section or the second circuit section. To change the product specification, the integrated circuit device further comprises receiving means for taking in a decision signal for determining the product specification, switching signal generator means, connected to the receiving means, for producing a switching signal for changing the product specification based on the decision signal, and switching means which receives the active signal and the switching signal, and which, based on the switching signal, changes the supply of the active signal to either the first circuit section or to the second circuit section.

This application is a division of application Ser. No. 07/935,174, filed Aug. 26, 1992, now abandoned.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a semiconductor integrated circuit device allowing the change of the product specification and a chip screening method therewith.

2. Description of the Related Art

In dynamic RAMs (hereinafter, referred to as DRAMs), the ratio of the refresh time T to the refresh cycle R is T/R=15.6 μsec. This ratio holds true for each generation of DRAMs: for example, 8 msec/512 cycles for the 1 Mbit DRAM generation, and 16 msec/1024 cycles (hereinafter, 1024 cycles are referred to as 1-kcycles) for the 4 Mbit DRAM generation.

For the 16 Mbit DRAM generation and later, the relationship should be 32 msec/2048 cycles (hereinafter, 2048 cycles are referred to as 2-kcycles). To reduce power consumption, prevent heat generation, and make the active current smaller, however, it is necessary to increase the number of refresh cycles to decrease the number of cell arrays to be activated at the same time. For example, the number of refresh cycles is increased to 4096 cycles (hereinafter, referred to as 4-kcycles).

Additionally, there is a need to reduce the number of in order to manufacture multi-bit symmetrical address products. For example, 1-kcycles are used. To the chip size from becoming larger and to ensure the sensitivity (C_(B) /C_(S) where C_(B) is the bit-line capacity and C_(S) is the cell capacity), the number of cells per bit-line cannot be changed from the present value (for example, 128 cells per bit-line), so that it is natural to change the number of refresh cycles.

Changing the number of refresh cycles means that the chip must be redesigned each time the number is changed. This imposes a heavy burden on the circuit designing personnel, resulting in reduced development efficiency.

More diversification of products requires factories to produce a variety of products simultaneously, reducing the production efficiency.

Additionally, the conventional chip screening test only rejects defective products. In this test, chips that fail to come up to the passing mark set for each product are judged to be unacceptable, and are discarded. Because of this, the conventional chip screening test has contributed to a poorer product yield.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a semiconductor integrated circuit device which is a solution to the problem that the diversification of products reduces development and production efficiencies, or which allows the product diversification without the sacrifice of development and production efficiencies.

Another object of the present invention is to provide a chip screening method capable of improving the product yield.

The foregoing object is accomplished by providing a semiconductor integrated circuit device comprising: an integrated circuit section containing a first circuit section having a first function and a second circuit section having a second function an active signal generator section for producing an active signal for activating the first circuit section or the second circuit section; receiving means for taking in a decision signal for determining the product specification; a switching signal generator section, connected to the receiving means, for producing a switching signal for changing the product specification based on the decision signal; and switching means which, based on the switching signal, changes the supply of the active signal to either the first circuit section or to the second circuit section.

with the present invention, a decision signal to determine the product specification is produced, and based on this signal, the function of the integrated circuit section is modified to meet the product specification, thereby making it possible to produce more than one type of product from a single product. This makes it unnecessary for the designing personnel to design the respective circuits to meet product specifications (or product types), increasing development efficiency. This approach also allows various types of products to share almost all manufacturing processes, improving production efficiency.

Further, the second object is accomplished by providing a chip screening method comprising: the chip screening step of selecting semiconductor chips, which includes a select test for determining whether semiconductor chips are acceptable or not, and a pause test for checking the memory cell for the charge retaining characteristics; and the product specification switching step of changing the product specification of the chips based on the result of the pause test.

In the chip screening test, by changing the product specification to that of the chip corresponding to the pause time based on the result of the pause test in the screening step, chips that would be unacceptable in the conventional test can be saved. This prevents the yield especially in the screening test from decreasing, and consequently improves the product yield.

Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate presently preferred embodiments of the invention, and together with the general description given above and the detailed description of the preferred embodiments given below, serve to explain the principles of the invention.

FIG. 1 is a block diagram of a DRAM according to a first embodiment of the present invention;

FIG. 2 is a circuit diagram of the product specification deciding circuit of FIG. 1;

FIG. 3 is a circuit diagram of another example of the receiving section of FIG. 2;

FIG. 4 is a block diagram of the counter circuit of FIG. 1;

FIGS. 5A to 5C are circuit diagrams of the counters of FIG. 4;

FIGS. 6A and 6B are circuit diagrams of the word-line step-up section of FIG. 1;

FIG. 7 is a circuit diagram of another example of the word-line step-up section of FIG. 1;

FIG. 8 is a circuit diagram of the X2 decoder of FIG. 1;

FIG. 9 is a circuit diagram of the I/O sense amplifier group and I/O sense amplifier control circuit of FIG. 1;

FIG. 10 is a block diagram of a DRAM according to a second embodiment of the present invention;

FIG. 11 is a circuit diagram of the product specification deciding circuit of FIG. 10;

FIG. 12 is a block diagram of a DRAM according to a third embodiment of the present invention;

FIG. 13 is a circuit diagram of the product specification deciding circuit of FIG. 12;

FIG. 14 is a block diagram of a DRAM according to a fourth embodiment of the present invention;

FIG. 15 is a circuit diagram of the receiving section and switching signal generator section of FIG. 14;

FIG. 16 is a circuit diagram of the address switching section of FIG. 14;

FIGS. 17A to 17C are circuit diagrams of the X-address buffer group of FIG. 14;

FIGS. 18A and 18B are circuit diagrams of the Y-address buffer group of FIG. 14;

FIGS. 19A to 19C are circuit diagrams of the counter circuit group of FIG. 14;

FIG. 20 is a circuit diagram of the word-line step-up section of FIG. 14;

FIG. 21 shows the logic of VR1K, VR2K, R1K, R2K, and R4K for each refresh cycle;

FIG. 22 shows the destinations of outputs A and B for each refresh cycle;

FIGS. 23A to 23C show address allocation for each refresh cycle;

FIG. 24 is a block diagram of the I/O sense amplifier group of FIG. 1;

FIG. 25 is a block diagram of the I/O sense amplifier group of FIG. 1;

FIG. 26 is a flowchart of a chip screening method according to the present invention;

FIG. 27 is a flowchart of another example of the chip screening method;

FIG. 28 shows the contents of step 2 in FIGS. 26 and 27; and

FIG. 29 is a sectional view of the pad of FIG. 2.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to the accompanying drawings, embodiments of the present invention will be explained. Like parts are indicated by corresponding reference characters throughout all the figures, and repetitious explanation will be omitted.

FIG. 1 is a block diagram of a DRAM according to a first embodiment of the present invention. The DRAM, i.e., the first embodiment, can operate in 2k-refresh cycle mode and 4k-refresh-cycle mode.

As shown in FIG. 1, a memory cell array (hereinafter, referred to as the MCA) 1 is divided into eight sections MCA₀ to MCA₇. An X-address buffer group 3, which receives an address input signal A_(in), produces a plurality of X-address signals. The X-address signals are set to first X-addresses X₀ to X₈ and second X-addresses X₉ and X₁₀ for division operation of MCA₀ to MCA₇, and to a third X-address X₁₁ for changing the product specification. An X1-decoder 5, which is supplied with the first X-addresses X₀ to X₈, decodes the first addresses X₀ to X₈ to produce a signal for selecting a word-line (a row) of the MCA. An X2-decoder 7 is supplied with the second X-addresses X₉ and X₁₀ and also with the third X-address X₁₁ via an address switching section 9. When the 2-kcycle DRAM is selected, the X2 decoder 7 decodes the second X-addresses X₉ and X₁₀ to produce a signal for simultaneously selecting one array from MCA₀ to MCA₃ and one array from MCA₄ to MCA₇, a signal for selecting sense amplifiers 11₀ to 11₃, and a signal for selecting I/O sense amplifier groups 13₀ to 13₃. When the 4-kcycle DRAM is selected, the X2-decoder 7 decodes the second X-addresses X₉ and X₁₀ and the third X-address X₁₁ to produce a signal for selecting one array from MCA₀ to MCA₇, a signal for selecting sense amplifiers 11₀ to 11₃, and a signal for selecting the I/O sense amplifier groups 13₀ to 13₃. In FIG. 1, blocks indicated by reference numerals 15₀ to 15₃ are word-line driving circuits, and blocks indicated by reference numerals 17₀ to 17₃ are sense amplifier driving circuits. A Y-address buffer group 19, which receives the address input signal A_(in), generates a plurality of Y-address signals. The Y-address signals are set to first Y-addresses Y₁ to Y₁₁ and a second Y-address Y₀. A Y1-decoder 21, which is supplied with the first Y-addresses Y₁ to Y₁₁, decodes the first Y-addresses Y₁ to Y₁₁ to produce a signal for selecting a bit line (a column) of the MCA. A Y2-decoder 23 decodes the second Y-address Y₀ to generate a signal for selecting, for example, one of the I/O sense amplifiers contained in the I/O sense amplifier group 13.

The DRAM of FIG. 1 is provided with a product specification deciding section 25 for deciding the product specification semipermanently. The product specification deciding section 25 is composed of a receiving section 27 that receives a product specification decision signal SDS to decide the product specification semipermanently, a switching signal generator section 29, connected to the receiving section 27, for producing internal switching signals φ2 and φ4 to change product specifications based on the signal SDS, and an address signal switching section 9 for selecting the destination of the address signal based on the signals φ2 and φ4.

The operation of the product specification deciding section 25 will be explained.

When the product specification decision signal SDS specifies the 2-kcycle refresh product (mode), the switching signal generator section 29 produces a 2-kcycle refresh product (mode) switching signal φ2, and supplies it to the address signal switching section 9 and I/O sense amplifier control circuit 31. The address signal switching section 9, based on the signal φ2, changes the third address X₁₁ to address X_(11Y) and supplies the resulting signal to the I/O sense amplifier control circuit 31.

When the product specification decision signal SDS specifies the 4-kcycle refresh product (mode), the switching signal generator section 29, based on the signal SDS, produces a 4-kcycle refresh product (mode) switching signal φ4, and supplies it to the address signal switching section 9 and X2-decoder 7. The address signal switching section 9 changes the third address X₁₁ to address X_(11X) based on the signal φ4 and supplies the resulting signal to the X2-decoder 7. The signals φ2 and φ4 are, for example, complementary to each other. The switching signal generator section 29 supplies the inversion in level of signal φ2 to the I/O sense amplifier control circuit 31.

The data read operation of the 2-kcycle refresh memory product and 4-kcycle refresh product (mode) will be explained.

In the case of the 2-kcycle refresh product (mode), the I/O sense amplifier control circuit 31 is supplied with address X_(11Y), which activates the former. The control circuit 31 produces a signal for selecting either a pair of I/O sense amplifiers 13₀ and 13₁ or a pair of I/O sense amplifiers 13₂ and 13₃. The X2-decoder 7 produces a signal for simultaneously selecting one array from MCA₀ to MCA₃ and one array from MCA₄ to MCA₇. The I/O sense amplifier group that finally supplies the data is one selected by the X2-decoder 7 and control circuit 31. The reading of data is done by causing the Y1-decoder 21 to decode the first Y-address produced at the Y-address buffer group 19, amplifying the information from the memory cell at the I/O sense amplifier group that finally supplies the data, and supplying the output signal Dout from the data output circuit 33. In FIG. 1, a block indicated by numeral 35 is a data input circuit to which the input signal Din is supplied.

In the case of the 4-kcycle refresh product (mode), address X_(11X) is supplied to the X2-decoder 7 instead of the I/O sense amplifier control circuit 31. The X2-decoder 7 then produces a signal for activating only one array of MCA₀ to MCA₇. The control signal 31 receives the inversion in level of signal φ2, and based on the inverted signal, produces a signal for selecting either a pair of I/O sense amplifiers 13₀ and 13₁ or a pair of I/O sense amplifiers 13₂ and 13₃. The I/O sense amplifier 13 finally activated is one selected by the X2-decoder 7 and control circuit 31.

As described above, a semiconductor integrated circuit device thus constructed enables a single chip to deal with different refresh-cycles by switching the third X-address X₁₁ to either X_(11X) or X_(11Y) at the switching section 9.

Refresh operation is performed by selecting a word-line and at the same time, by operating the sense amplifiers 11₀ to 11₃.

The DRAM of FIG. 1 is provided with a counter refresh circuit group 37, which contains a counter circuit 39. The counter circuit 39 is supplied with a signal CTRS for commanding the count start and switching signals φ2 and φ4. The counter circuit 39, based on the signal CTRS, supplies counter output signals C₀ to C₁₁ that count up X-addresses X₀ to X₁₁ in sequence, and based on the signals φ2 and φ4, changes the number of output signals C₀ to C₁₁. This is done to make the number of X-addresses equal to the number of counter output signals, because the 2-kcycle product (mode) differs from the 4-kcycle product (mode) in the number of X-addresses supplied to the row decoder (X1-decoder 5 and X2-decoder 7). In this embodiment, when the switching signal φ2 is supplied, the counter circuit 39 will not supply signal C₁₁. This is because the third X-address X₁₁ is ignored since in the case of the 2-kcycle product (mode), the third X-address X₁₁ is not supplied to the row decoder (X1-decoder 5 and X2-decoder 7). When the switching signal φ4 is supplied (or when the level of switching signal φ2 is reversed and supplied), the counter circuit 39 will supply signal C₁₁.

The DRAM of FIG. 1 is provided with a word-line boosting section 41, to which switching signals φ2 and φ4 and boosting signal φWL are supplied. The word-line boosting section 41 raises the word-line voltage based on the signal φWL. In FIG. 1, numeral 43 indicates the boosting line to which a boosting voltage is supplied. In the present invention, the word-line boosting capacitance is also changed on the basis of signals φ2 and φ4. This is done to optimize the level of the word-line boosting capacitance according to a change in the word-line load capacitance, since the number of word lines activated at a time in the 2-kcycle product differs from that in the 4-kcycle product. In the case of 2-kcycle products, because two MCAs are selected, this increases the number of word lines activated, making the load capacitance larger. To compensate for the increase in the load capacitance, the word-line boosting section 41 increases the word-line boosting capacitance based on signal φ2 in the case of the 2-kcycle product. When signal φ4 is supplied (or when the level of switching signal φ2 is inverted and supplied; in the case of 4-kcycle product), the word-line boosting section 41 reduces the word-line boosting capacitance more than in the 2-kcycle product.

The peripheral circuitry of the FIG. 1 DRAM contains a /RAS (hereinafter, / is used as a symbol indicating an inverted signal) circuit group 45, a /CAS circuit group 47, and a/WE circuit group 49. The details of these circuits will be omitted in this specification.

FIG. 2 is a circuit diagram showing a concrete construction of the product specification deciding section 25.

As shown in FIG. 2, the receiving section 27 is composed of a pad P connected to the output terminal 51, and a resistance one end of which is connected to the junction point of the output terminal 51 and pad P and the other end of which is connected to the ground GND. This section 27 allows the output terminal 51 to be set to either a H (high) level or a L (low) level depending on whether a wire applied with a high potential VCC is bonded to the pad P (the decision signal SDS is in the H-level) or not (the signal SDS is in the L-level). The output terminal 51 is connected to the input terminal 53 of the switching signal generator section 29.

The switching signal generator section 29 is made up of a first inverter 55 whose input is connected to the input terminal 53, and a second inverter 57 whose input is connected to the output of the first inverter 55. The output of the inverter 55 is extracted as a first refresh switching signal φ2, and the output of the inverter 57 is extracted as a second refresh switching signal φ4.

The address switching section 9 is composed of switches (transfer gates) 59₁ to 59₄ consisting of n-channel MOSFET (hereinafter, referred to as NMOS) and p-channel MOSFET (hereinafter, referred to as PMOS) whose gates are supplied with switching signals φ2 or φ4. The X-address buffer group 3 supplies an address signal A_(11R) (X₁₁) and its inverted signal /A_(11R) (/X₁₁)The address signal A_(11R) (X₁₁) is supplied to one end of each of switches 59₁ and 59₂. The other end of switch 59₁ is connected to the X2-decoder 7, and the other end of the switch 59₂ is connected to the I/O sense amplifier control circuit 31. The inverted signal /A_(11R) (/X₁₁) is supplied to one end of each of switches 59₃ and 59₄. The other end of switch 59₃ is connected to X2-decoder 7, and the other end of switch 59₄ is connected to the I/O sense amplifier control circuit 31.

The gate of each of the PMOS of switch 59₁, NMOS of switch 59₂, PMOS of switch 59₃, and NMOS of switch 59₄ is all connected to the output of the inverter 55. The gate of each of the NMOS of switch 59₁, PMOS of switch 59₂, NMOS of switch 59₃, and PMOS of switch 59₄ is all connected to the output of the inverter 57.

Connecting this way allows either a pair of switches 59₁ and 59₃ or a pair of switches 59₂ and 59₄ to be selected and operated. For example, when the output of inverter 55 is in the H level and the output of inverter 57 is in the L-level (in the case of the 2-kcycle refresh product), the switches 59₂ and 59₄ turn on, and address signal A_(11R) and its inverted signal /A_(11R) are supplied as addresses X_(11Y) and /X_(11Y) to the I/O sense amplifier control circuit 31.

Contrarily, when the output of inverter 55 is in the L-level and the output of inverter 57 is in the H level (in the case of the 4-kcycle refresh product), the switches 59₁ and 59₃ turn on, and address signal A_(11R) and its inverted signal /A_(11R) are supplied as addresses X_(11X) and /X_(11X) to the X2-decoder 7.

As noted above, the product specification deciding section 25, depending on whether to bond a wire applied with a high voltage VCC to the pad P or not, switches address signal A_(11R) and its inverted signal /A_(11R) either to the X2-decoder 7 or to the I/O sense amplifier control circuit 31.

FIG. 3 is a circuit diagram showing another construction of the receiving section 27.

The receiving section 27 of FIG. 2 may be constructed as shown in FIG. 3. Specifically, one end of the resistance R is connected to the high potential VCC, and the Other end of the resistance R is connected to one end of the fuse F, the other end of which is connected to the ground GND. The junction point of the resistance R and fuse F is connected to the output terminal 51.

In the receiving section 27 thus constructed, cutting the fuse F enables the output terminal 51 to be set to the H-level, and uncutting the fuse F allows the output terminal 51 to be set to the L-level. The receiving section 27 of FIG. 3 operates in the same manner as that of FIG. 2.

FIG. 4 is a block diagram of the counter circuit 39 of FIG. 1.

As shown in FIG. 4, the counter circuit 39 is composed of counters 61₀ to 61₁₁. The least-significant counter 610 is supplied with the signal CTRS commanding the count start and its inverted signal BCTRS. The counter 61₀, based on the signal CTRS and its inverted signal BCTRS, supplies a counter output signal C₀ and its inverted signal BC₀. The counter 61₁ in the next stage is supplied with the output (signal C₀ and its inverted signal BC₀) of the counter 61₀ in the preceding stage. The counter 61₁, based on the signal C₀ and its inverted signal BC₀, supplies a counter output signal C₁ and its inverted signal BC₁. In this way, counters 61₁ to 61₁₁ take in the outputs of the preceding stages, respectively, and based on the signals taken in, supply signals C₁ to C₁₁ and their inverted signals BC₁ to BC₁₁ in sequence. The most-significant counter 61₁₁ is supplied with the output (signal C₁₀ and its inverted signal BC₁₀) of the counter 61₁₀ in the preceding stage (not shown) and switching signal φ4. The counter 61₁₁, only when, for example, supplied with the H-level switching signal φ4 (in the case of the 4-kcycle refresh product), supplies counter output signal C₁₁ and its inverted signal BC₁₁ on the basis of signal C₁₀ and its inverted signal BC₁₀. The counter 61₁₁, when, for example, supplied with the L-level switching signal φ4 (in the case of the 2-kcycle refresh product), supplies neither signal C₁₁ nor its inverted signal BC₁₁. Thus, for the 2-kcycle refresh product, the output of the counter 61₁₁ is ignored.

FIG. 5A to 5C are a circuit diagram showing a concrete construction of the counters of FIG. 4.

The circuit configuration of each of counters 61₀ to 61₁₀ is the same, so that only counters 61₀ and 61₁ and the most-significant counter 61₁₁ will be described.

FIGS. 5A and 5B are circuit diagrams of counters 61₀ and 61₁, respectively.

As shown in FIG. 5A, the output of the clocked inverter 63₀ is connected to the input of the inverter 65₀ (node al). The output of inverter 65₀ is connected to the gate of each of PMOS 67₀ and NMOS 69₀. The drain of PMOS 67₀ is connected to that of NMOS 69₀ (node a2). The source of PMOS 67₀ is connected to the drain of PMOS 71₀, and the source of PMOS 71₀ is connected to a high potential power supply. The gate of PMOS 71₀ is supplied with signal CTRS. The source of NMOS 69₀ is connected to the drain of NMOS 73₀, and the source of NMOS 73₀ is connected to a low potential power supply (for example, the ground). The gate of NMOS 73₀ is supplied with the inverted signal BCTRS. Node a2 is connected to node al as well as to the input of the clocked inverter 75₀, which is driven by the clock opposite in phase to that of the clocked inverter 63₀. The output of the clocked inverter 75₀ is connected to the input of the inverter 77₀ (node a3). The output of the inverter 77₀ is connected to the gate of each of PMOS 79₀ and NMOS 81₀ (node a4). The drain of PMOS 79₀ is connected to that of NMOS 81₀ (node a5). The source of PMOS 79₀ is connected to the drain of PMOS 83₀, and the source of PMOS 83₀ is connected to a high potential power supply. The gate of PMOS 83₀ is supplied with the inverted signal BCTRS. The source of NMOS 81₀ is connected to the drain of NMOS 85₀, whose source is connected to a low potential power supply (for example, the ground). The gate of NMOS 85₀ is supplied with the signal CTRS. Node a5 is connected to node a3. Node a4 is connected to the counter output signal terminal Cj (C₀) (node a6). Node a6 is connected to the input of the inverter 87₀ (node a7). The output of inverter 87₀ is connected to the inverted counter output signal terminal BCj (BC₀). Node a7 is connected to the input of inverter 63₀. Explanation of FIG. 5B will be omitted. The construction of FIG. 5B is almost the same as that of FIG. 5A except for input signals (Cj-1, BCj-1) and output signals (Cj, BCj).

The most-significant counter 61₁₁ will be explained.

As shown in FIG. 5C, node a2 is connected to the gate of PMOS 89₁₁ (node a8) as well as to the gate of NMOS 91₁₁. Node a8 is connected to node al. The drain of PMOS 89₁₁ is connected to the source of PMOS 93₁₁. The source of PMOS 89₁₁ is connected to a high potential power supply. The gate of PMOS 93₁₁ is connected to signal CJ-1 (C₁₀). The drain of NMOS 91₁₁ is connected to the source of NMOS 95₁₁, which is also connected to the drain of NMOS 97₁₁. The gate of NMOS 95₁₁ is supplied with the inverted signal BCj-1 (C₁₀). The drain of PMOS 93₁₁ is connected to that of NMOS 95₁₁ (node a9). Node a9 is connected to the drain of PMOS 99₁₁, whose source is connected to a high potential power supply. The gate of each of PMOS 99₁₁ and NMOS 97₁₁ is supplied with switching signal φ4. Node a9 is connected to node a3.

The operation of the counter of FIG. 5 will be explained.

It is assumed that the first stage counter 61₀ is supplied with signal Cj-1 (CTRS) and inverted signal BCj-1 (BCTRS), and that the clocked inverter 63₀ and the clocked inverter 101₀ made up of PMOS 79₀ and PMOS 83₀ and NMOS 81₀ and NMOS 85₀ are turned on. In this state, the clocked inverter 75₀ and the clocked inverter 10₃₀ made up of PMOS 67₀ and PMOS 71₀ and NMOS 69₀ and NMOS 73₀ are in the off site because they are supplied with the clock opposite in phase to that of the clocked inverter 63₀. As a result, a latch circuit composed of the inverter 77₀ and clocked inverter 101₀ latches a signal that brings node a4 to the H-level. This allows the counter output signal terminal Cj to supply the H-level signal (C₀), and the inverted counter output signal terminal BCj to supply the L-level signal (BC₀). When the level of the clock signal is inverted, the clocked inverters 63₀ and 101₀ are turned off and the clocked inverters 75₀ and 103₀ are turned on. As a result, a latch circuit composed of the inverter 65₀ and clocked inverter 103₀ latches a signal that brings node a2 to the L-level. When node a2 is in the L-level, the clocked inverter 75₀ supplies the H-level signal, bringing node a4 to the L-level. Therefore, the counter output signal terminal Cj supplies the L-level signal (C₀) opposite in level to that of the signal described above, and the inverted counter output signal terminal BCj supplies the H-level signal (BC₀) whose signal level has been inverted. The next-stage counter 61₁ is supplied with the output signals C₀ and BC₀ and driven by them. The subsequent counters 61₂ to 61₁₀ operate the same way. The eleventh-stage counter 61₁₀ supplies signals C₁₀ and BC₁₀, which are used to drive the final counter 61₁₁. In the counter 61₁₁, a low potential is supplied via NMOS 97₁₁ to the clocked inverter 75₁₁ made up of PMOS 89₁₁, PMOS 93₁₁, NMOS 91₁₁, and NMOS 95₁₁. The gate of NMOS 97₁₁ is supplied with the switching signal φ4. Because the L-level switching signal turns off NMOS 97₁₁, the clocked inverter 75₁₁ does not operate. Thus, the counter 61₁₁ supplies effective counter output signal Cj (C₁₁) and inverted output signal BCj (BC₁₁) only when the switching signal is in the H-level.

FIGS. 6A and 6B are circuit diagrams showing a concrete construction of the word-line boosting section 41 of FIG. 1.

As shown in FIG. 6A, the word-line boosting section 41 contains a first boosting capacitor 105₁ and second boosting capacitor 105₂. One electrode of each of the first and second boosting capacitors 105₁ and 105₂ is connected to the boosting line 43. The line 43 is connected to the boosting driving circuit 15₀ to 15₇ shown in FIG. 1. The other electrode of capacitor 105₁ is connected to the output of the first word-line boosting circuit 107₁, and the other electrode of capacitor 105₂ is connected to the output of the second word-line boosting circuit 107₂. The input of the first word-line boosting circuit 107₁ is supplied with a boosting signal φWL. The input of the second word-line boosting circuit 107₂ is connected to the output of the AND gate (logical product gate) 109. The input of AND gate 109 is supplied with the signal φWL and switching signal φ2. Each of the boosting circuits 107₁ and 107₂ is composed of two inverters connected in series between the input and output.

The operation of the word-line boosting section 41 of FIG. 6 will be explained. When both the boosting signal φWL and switching signal φ2 are in the H-level (in the case of the 2-kcycle product), both boosting circuits 107₁ and 107₂ are activated. When the switching signal φ2 is in the L-level (in the case of the 4-kcycle product), only the boosting circuit 107₁ is activated. Thus, the boosting section 41 of the 2-kcycle product supplies a higher boosting capacitance than that of the 4-kcycle product.

As shown in FIG. 6B, the step-up section 41 may be made up of the boosting circuit 107₂ connected between the input and output with the input being connected to a NAND gate 111. The boosting section 41 of FIG. 6B operates in the same manner as the boosting section 41 of FIG. 6A.

FIG. 7 is a block diagram showing another construction of the word-line boosting section 41.

As shown in FIG. 7, the boosting line 43 connected to the second boosting capacitor 105₂ may be prepared as a mask option. Specifically, in the manufacturing processes, the conducting layer patterning of the boosting line 43 may be designed to allow selection of a mask with the pattern of boosting line 43 connected only to the first boosting capacitor 105₁ or a mask with the pattern of boosting line 43' connected to the second boosting capacitor 105₂ in addition to that of the first one.

FIG. 8 is a circuit diagram showing a concrete construction of the X2-decoder 7 of FIG. 1.

AND gates 113₀ to 113₇ are provided as shown in FIG. 8. The inputs of AND gates 113₀ to 113₇ are supplied with the second addresses X₉ (/X₉)and X₁₀ (/X₁₀) and the third address X_(11X) (/X_(11X)) in a different combination. The third address inputs of AND gates 113₀ to 113₇ are connected to either the sources or drains of PMOS 115₀ to PMOS 115₇. The gates of PMOS 115₀ to PMOS 115₇ are supplied with the switching signal φ4. The outputs CBS0 to CBS7 of AND gates 113₀ to 113₇ are extracted as cell array block select signals.

The operation of X2-decoder 7 will be explained. When the switching signal φ4 is in the L-level (in the case of the 2-kcycle product), PMOS 115₀ to PMOS 115₇ are each turned on, causing the third address input to remain at the H-level. Therefore, the third X-address input (X_(11X) and /X_(11X)) is ignored. When the switching signal φ4 is in the H-level (in the case of the 4-kcycle product), PMOS 115₀ to PMOS 115₇ are each turned off, activating the third X-address input. As a result, AND gates 113₀ to 113₇ take in addresses X_(11X) and /X_(11X).

FIG. 9 is a circuit diagram showing a concrete construction of the I/O sense amplifier group 13 and I/O sense amplifier control circuit 31 shown in FIG. 1.

As shown in FIG. 9, the I/O sense amplifier control circuit 31 contains AND gates 117₀ and 117₁. Each of AND gates 117₀ and 117₁ is supplied with the I/O sense timing signal φ_(IOS) and address X_(11Y) and X_(11Y). The third X-address input of each of AND gates 117₀ and 117₁ is connected to the sources or drains of PMOS 119₀ and PMOS 119₁. The gates of PMOS 119₀ and PMOS 119₁ are supplied with the switching signal φ2. The outputs φ_(S01) and φ_(S23) of AND gates 117₀ and 117₁ are extracted as the I/O sense amplifier group select signals to select the I/O sense amplifier groups 13₀ to 13₃.

The operation of the I/O sense amplifier control circuit 31 will be explained.

When the switching signal φ2 is in the L level (in the case of the 4-kcycle product), PMOS 119₀ to PMOS 119₇ are each turned on, causing the third X-address input to remain at the L level. Therefore, the third X-address input (X_(11Y) and /X_(11Y)) is ignored. When the switching signal φ2 is in the H-level (in the case of the 2-kcycle product), PMOS 119₀ and PMOS 119₁ are each turned off, activating the third X-address input. As a result, AND gates 119₀ to 119₁ take in addresses X_(11Y) and /X_(11Y).

FIG. 9 shows a primary portion of the I/O sense amplifier groups 13₀ to 13₃.

As shown in FIG. 9, the I/O sense amplifier groups 13₀ to 13₃ are each made up of OR gates 121₀ to 121₃ and AND gates 123₀ to 123₃. The inputs of OR gates 121₀ to 121₃ are supplied with block select signals CBS0 to CBS7. The inputs of AND gates 123₀ to 123₃ are supplied with the outputs of OR gates 121₀ to 121₃, and I/O sense amplifier select signals φ_(S01) and φ_(S23). The outputs of AND gates 123₀ to 123₃ are extracted as I/O sense timing signals φ_(IOS0) and φ_(IOS3).

A second embodiment of the present invention will be explained.

FIG. 10 is a block diagram of a DRAM according to the second embodiment of the present invention. This figure centers especially on the product specification deciding section 25. The DRAM shown in FIG. 1 is a device where the X-address allocating method is the same as the Y-address allocating method, such as a DRAM of a x1 bit construction. Two types of products with different refresh-cycles can be obtained from a single DRAM of FIG. 1.

In some devices, however, as the refresh cycle changes, the X-address allocation and Y-address allocation change accordingly. They include x4 bit DRAMs, x8 bit DRAMs, and x16 bit DRAMs, or multi-bit DRAMs. In the multi-bit DRAM, as the refresh-cycle changes, the number of X-addresses and that of Y-addresses change. Therefore, to realize several types of products with different refresh-cycles, it is necessary to change the allocation of X-addresses and Y-addresses according to the difference in refresh cycle. A DRAM according to the second embodiment is a device that allows the change of address allocation depending on the difference in refresh-cycle.

FIG. 10 is a block diagram of a x4 bit DRAM. In a DRAM of x4 bits with 2k-refresh cycles, the number of X-addresses is equal to that of Y-addresses, or their addresses are symmetrical. For example, X-addresses range from X₀ to X₁₀, and Y-addresses range from Y₀ to Y₁₀. In a DRAM of x4 bits with 4 k-refresh-cycles, the number of X-addresses differ from that of Y-addresses, or their addresses are asymmetrical. For example, X-addresses range from X₀ to X₁₁, and Y-addresses range from Y₀ to Y₉.

In the DRAM shown in FIG. 10, when the refresh cycle is set to 4-kcycles, X-address X₁₁ is changed to address X_(11X) at the address switching section 9, and then supplied to the X2-decoder 7. At this time, Y-address Y₁₀ is prevented from being supplied from the Y-address buffer group 19. A detailed description of this will be found in a later embodiment.

When the refresh cycle is set to 2-kcycles, Y-address Y₁₀ is changed to address X_(11Y) at the address switching section 9, and then supplied to the I/O sense amplifier control circuit 31. At this time, X-address X₁₁ is prevented from being supplied from the X-address buffer group 3. As with Y-address Y₁₀, a detailed description of X-address X₁₁ will be found in a later embodiment.

FIG. 11 is a circuit diagram of the product specification deciding section 25 of FIG. 10.

As shown in FIG. 11, the address switching section 9 contains switches (transfer gates) 59₁ to 59₄ composed of NMOS and PMOS elements. X-addresses X₁₁ (A_(11R)) and /X₁₁ (/A_(11R)) are supplied to switches 59₁ and 59₃, respectively. Y-addresses Y₁₀ (A_(10C)) and /Y₁₀ (/A_(10C)) are supplied to switches 59₂ and 59₄, respectively. Thus, when the switching signal φ2 is in the H-level and the switching signal φ4 is in the L-level (in the case of the 2-kcycle-refresh product), Y-addresses Y₁₀ and /Y₁₀ are supplied as addresses X_(11Y) and /X_(11Y) to the I/O sense amplifier control circuit 31 via switches 59₂ and 59₄.

When the switching signal φ2 is in the L-level and the switching signal φ4 is in the H-level (in the case of the 4-kcycle refresh product), X-addresses X₁₁ and /X₁₁ are supplied as addresses X_(11X) and /X_(11X) to the X2-decoder 7 via switches 59₁ and 59₃.

The same reasoning may be applied to x8 bit and x16 bit devices.

A third embodiment of the present invention will be explained.

FIG. 12 is a block diagram of a DRAM according to the third embodiment. This figure centers primarily on the product specification deciding section 25. The DRAM of the third embodiment enables the change of refresh cycle as well as bit construction. For example, a single DRAM may be formed into four types of products: a x1 bit product at 2-kcycles, a x1 bit product at 4-kcycles, a x4 bit product at 2-kcycles, and a x4 bit product at 4-kcycles.

As shown in FIG. 12, the address switching section 9, based on the switching signals φ2 and φ4, supplies address Y_(10Y) to the column decoder 127.

In the DRAM of FIG. 12, for a x1 bit construction at 2k-refresh cycles, the address switching section 9, based on the switching signals φ2 and φ4, changes X-address signal X₁₁ to address Y_(10Y) to supply the latter to the column decoder 127. For a x1 bit construction at 4k-refresh cycles, the address switching section 9, based on the switching signals φ2 and φ4, changes Y-address signal Y₁₀ to address Y_(10Y) to supply address Y_(10Y) to the column decoder 127.

For a x4 bit construction at 2k-refresh cycle and a x4 bit construction at 4k-refresh cycles, the address switching section 9 is prevented from supplying address Y_(10Y). An alternative to this is to connect between the address switching section 9 and the column decoder 127 a circuit that ignores address Y_(10Y) based on the signal specifying a x4 bit construction.

In this way, by constructing the address switching section 9 so that for a x1 bit construction, address Y_(10Y) may be produced from X-address or Y-address based on the switching signals φ2 and φ4, while for a x4 bit construction, address Y_(10Y) may be ignored independently of the switching signals φ2 and φ4, it is possible to realize a DRAM that enables not only the change of refresh cycle but also that of bit construction.

FIG. 13 is a circuit diagram of the product specification deciding section 25 of FIG. 12.

As shown in FIG. 13, the address switching section 9 contains switches (transfer gates) 59₁ to 59₄ and switches 129₁ to 129₄ composed of NMOS and PMOS elements. X-address X₁₁ (A_(11R)) is supplied to switches 59₁ to 129₁. Similarly, the inverted X-address /X₁₁ (/A_(11R)) is supplied to switches 59₃ and 129₃ ; Y-address Y₁₀ (A_(10C))is supplied to switches 59₂ to 129₂ ; and the inverted /Y₁₀ (/A_(10C)) is supplied to switches 59₄ and 129₄. The switching signal φ4 is supplied to the gate of each of the NMOS of switch 59₁, the PMOS of switch 59₂, the NMOS of switch 59₃, the PMOS of switch 59₄, the PMOS of switch 129₁, the NMOS of switch 129₂, the PMOS of switch 129₃, and the NMOS of switch 129₄. The switching signal φ2 is supplied to the gate of each of the PMOS of switch 59₁, the NMOS of switch 59₂, the PMOS of switch 59₃, the NMOS of switch 59₄, the NMOS of switch 129₁, the PMOS of switch 129₂, the NMOS of switch 129₃, and the PMOS of switch 129₄.

With the product specification deciding section 25 of the above-described construction, when the switching signal φ2 is in the H-level and the switching signal φ4 is in the L-level (in the case of the 2-kcycle refresh product of x1 bits), switches 59₂ and 59₄ turn on, so that Y-addresses Y₁₀ and /Y₁₀ are supplied to the sense amplifier control circuit 31 via switches 59₂ and 59₄. Further, because switches 129₁ and 129₃ turn on, so that X-addresses X₁₁ and /X₁₁ are supplied to the column decoder 127 via switches 129₁ and 129₃.

When the switching signal φ2 is in the L-level and the switching signal φ4 is in the H-level (in the case of the 4-kcycle refresh product of x1 bits), switches 59₁ and 59₃ turn on, so that X-addresses X₁₁ and /X₁₁ are supplied to the X2 decoder 7 via switches 59₁ and 59₃. Further, because switches 129₂ and 129₄ turn on, so that Y-addresses Y₁₀ and /Y₁₀ are supplied to the column decoder 127 via switches 129₂ and 129₄.

Between the address switching section 9 and column decoder is connected a circuit (not shown) that ignores addresses Y_(10Y) and /Y_(10Y) based on the signal specifying a x4 bit construction. To select a x4 bit construction, this circuit is used to prevent addresses Y_(10Y) and /Y_(10Y) from being supplied to the column decoder 127.

A fourth embodiment of the present invention will be explained.

FIG. 14 is a block diagram of a DRAM according to the fourth embodiment. This figure centers primarily on the product specification deciding section 25. The DRAM of this embodiment allows the change of refresh cycle to more than two different cycles, for example, any of 1-kcycles, 2-kcycles, and 4-kcycles.

FIG. 15 is a circuit diagram of the receiving section 27 and switching signal generating section 29 of FIG. 14.

As shown in FIG. 15, the receiving section 27 contains two bonding pads P1 and P2. Pad P1 is supplied with a first product specification decision signal VR2K, and pad P2 with a second product specification decision signal VR1K. A first output terminal 200 connected to pad P1 is connected to a first input of a NOR gate 202. A second output terminal 204 connected to pad P2 is connected to a first input of a NAND gate 206. A second input of the NAND gate 206 is connected to bonding pad P3 supplied with the signal x16 determining the bit construction. To select a x16 bit construction, a H-level signal is supplied to pad P3. Supplying a L-level signal to pad P3 allows the formation of the product of a x8 bit construction. The output of a NAND gate 206 is connected to the input of an inverter 208. The output of the inverter 208 is extracted as a first switching signal R1K, and is connected to the second output of the NOR gate 202. The output of the NOR gate 202 is extracted as a third switching signal R4K as well as a second switching signal R2K via an inverter 210. As shown in FIG. 14, among these switching signals R1K, R2K, and R4K, the signals R1K and R4K are supplied to the address switching section 9 and counter circuit 37, while the signals R1K and R2K are supplied to the X-address buffer group 3, Y-address buffer group 19, and word-line step-up section 41.

FIG. 21 shows the logic of VR1K, VR2K, R1K, R2K, and R4K for each refresh cycle in the case of the x16 bit product. In the figure, character H indicates a H-level signal, and L a L-level signal.

FIG. 16 is a circuit diagram of the address switching section 9 of FIG. 14.

As shown in FIG. 16, the address switching section 9 contains switches (transfer gates) 212₁ to 212₄ composed of NMOS and PMOS elements. The switch 212₁ is supplied with Y-address Y8 (A8C). Similarly, the switch 212₂ is supplied with X-address X₁₁ (A_(11R)); switch 212₃ with Y-address Y₉ (A9C); and switch 212₄ with X-address X₁₀ (X₁₀ R). The third switching signal R4K is supplied to the gate of each of the PMOS of switch 212₁ and the NMOS of switch 212₂. The switching signal R4K is also supplied via the inverter 214₁ to the gate of each of the NMOS of switch 212₁ and the PMOS of switch 212₂. The first switching signal R1K is supplied to the gate of each of the NMOS of switch 212₃ and the PMOS of switch 212₄. The switching signal R1K is also supplied via the inverter 214₂ to the gate of each of the PMOS of switch 210₃ and the NMOS of switch 212₄. FIG. 16 shows only the portions to which addresses Y₈ Y₉, X₁₀, and X₁₁ are supplied, while omitting the portions to which the inverted addresses /Y₈, /Y₉, /X₁₀, and /X₁₁ are supplied. The circuit arrangement of the portions to which the inverted addresses are supplied is the same as that shown in FIG. 16.

With the address switching section 9 of the above construction, when the switching signal R1K is in the H-level and the switching signal R4K is in the L-level (in the case of the 1-kcycle-refresh product), switches 2121 and 212₃ turn on, which allows Y-addresses Y₈ and Y₉ to be supplied as output signals A and B by way of switches 212₁ and 212₃.

When the switching signal R1K is in the L-level and the switching signal R4K is in the L-level (in the case of the 2-kcycle-refresh product), switches 212₁ and 212₄ turn on, which allows Y-address Y₈ and X-address X₁₀ to be supplied as output signals A and B by way of switches 212₁ and 212₄.

When the switching. signal R1K is in the L level and the switching signal R4K is in the H-level (in the case of the 4-kcycle-refresh product), switches 212₂ and 212₄ turn on, which allows X-addresses X₁₀ and X₁₁ to be supplied as output signals A and B by way of switches 212₂ and 212₄.

FIG. 22 lists the destinations of outputs A and B for each refresh cycle in the case of the x16 bit product. Characters Y8Y, Y9Y, X10X, and X11X in FIG. 22 correspond to those in FIG. 14.

FIG. 17 is a circuit diagram of the X-address buffer group 3 of FIG. 14. FIG. 17A is a circuit diagram of the address generating section that produces addresses A0 to A11; FIG. 17B is a circuit diagram of the X-address generating section that produces X-addresses X0 (A0R) to X9 (A9R); and FIG. 17C is a circuit diagram of the X-address generating section that produces X-addresses X10 (A10R) to X11 (A11R).

As shown in FIG. 17A, the address generating section 216, which is supplied with an address input Ain, produces an address Aj and its inverted address BAj from the address input Ain on the basis of the row address accept signal RACP. In this embodiment, 12 address generating sections 216 of FIG. 17A are used. These sections 216₀ to 216₁₁ generate addresses A0 (BA0) to A11 (BA11), respectively. In FIG. 17A, BRHLD indicates a row address hold signal (B means the inversion of signal level), BRLTC a row address latch signal (B means the inversion of signal level), and VRAD a reference potential.

The addresses A0 (BA0) to A11 (BA11) produced at the address generating sections 216₀ to 216₁₁ are supplied to the X-address generating sections 218₀ to 218₁₁ shown in FIGS. 17B and 17C. Based on the row address transfer signal BRTRS (B means the inversion of signal level), the X-address generating sections 218₀ to 218₁₁ produce X-addresses X0 (A0R) to X₁₁ (A11R) from addresses A0 (BA0) to A11 (BA11). Among the X-address generating sections 218₀ to 218₁₁, 218₁₀ and 218₁₁ have the circuit construction of FIG. 17C in order to cope with a change in the number of X-addresses due to the modification of refresh cycle. Specifically, each of X-address generating sections 218₁₀ and 218₁₁ contains NOR circuits 220 and 222, and X-address is supplied after passing through these NOR circuits 220 and 222. The first inputs of the NOR circuits 220 and 222 are supplied with signals C1 and C2, respectively. The X-address generating sections 218₁₀ and 218₁₁ supply X-addresses or not, depending on the signals C1 and C2. In this embodiment, the signals C1 and C2 are set as follows: in the generating section 218₁₀ that produces X-address X10 (A10R), the first switching signal R1K is used as signals C1 and C2; and in the switching section 218₁₁ that produces X-address X11 (A11R), the second switching signal R2K is used as signals C1 and C2. In FIGS. 17B and 17C, Cj and BCj indicate the counter outputs, and CTRS a count transfer signal.

With the X-address generating sections 218₁₀ and 218₁₁ of the aforesaid construction, when the switching signal R1K is in the H-level and the switching signal R2K is in the H-level (in the case of the 1-kcycle-refresh product), the generating sections 218₁₀ and 218₁₁ will not produce X-addresses X10 and X11. As explained in FIG. 16, the 1-kcycle-refresh product does not use X-addresses X10 and X11 (but uses Y-addresses Y8 and Y9). As a result, unnecessary X-addresses are not produced at the X-address buffer group 3, thereby reducing the power consumption, or preventing erroneous operations.

When the switching signal R1K is in the L-level and the switching signal R2K is in the H-level (in the case of the 2-kcycle-refresh product), the generating section 218₁₀ will produce X-address X10, and the generating section 218₁₁ will not produce X-addresses X11. Thus, as with the 1-kcycle-refresh product, unnecessary X-addresses are not produced at the X-address buffer group 3.

When the switching signal R1K is in the L-level and the switching signal R2K is in the L-level (in the case of the 4-kcycle-refresh product), the generating sections 218₁₀ and 218₁₁ will both produce X-addresses X10 and X11.

FIG. 18 is a circuit diagram of the Y-address buffer group 19 of FIG. 14. FIG. 18A is a circuit diagram of the Y-address generating section that produces Y-addresses Y0 (A0C) to Y7 (A7C) and FIG. 18B is a circuit diagram of the Y-address generating section that produces Y-addresses Y8 (A8C) to Y9 (A9C).

As shown in FIGS. 18A and 18B, the Y-address generating sections 224₀ to 224₉, which are supplied with address input Ain, produce Y-addresses Y0 (A0C) to Y9 (A9C) from address input Ain on the basis of a first column address latch signal CLTC and the second column address latch signal CLTD with a little delay behind the signal CLTC. Among the Y-address generating sections 224₀ to 224₉, 224₈ and 224₉ have the circuit arrangement of FIG. 18B in order to cope with a change in the number of Y-addresses due to the modification of refresh-cycle. Specifically, each of Y-address generating sections 224₈ and 224₉ contains NOR circuits 226 and 228, and Y-address is supplied after passing through the NOR circuits 226 and 228. The first inputs of the NOR circuits 226 and 228 are supplied with signals D1 and D2, respectively. The Y-address generating sections 224₈ and 224₉ supply Y-addresses or not, depending on signals D1 and D2. In this embodiment, signals D1 and D2 are set as follows: in the generating section 224₈ that produces Y-address Y8 (A8C), the switching signal BR2K, the inversion in signal level of the second switching signal R2K, is used as signals D1 and D2; and in the generating section 224₉ that produces Y-address Y9 (A9C), the switching signal BR1K, the inversion in signal level of the first switching signal R1K, is used as signals D1 and D2.

With the Y-address generating sections 224₈ and 224₉ of the aforesaid construction, when the inverted switching signal BR1K is in the L-level and the inverted switching signal BR2K is in the L-level (in the case of the 1-kcycle-refresh product), the generating sections 224₈ and 224₉ produce Y-addresses Y8 and Y9, respectively.

When the inverted switching signal BR1K is in the H-level and the inverted switching signal BR2K is in the L-level (in the case of the 2-kcycle-refresh product), the generating section 224₈ will produce Y-address Y8, and the generating section 224₉ will not produce Y-address Y₉.

When the inverted switching signal BR1K is in the H-level and the inverted switching signal BR2K is in the H-level (in the case of the 4-kcycle-refresh product), none of the generating sections 224₈ and 224₉ produce Y-address Y8 or Y9.

FIG. 19 is a circuit diagram of the counter circuit group 37 of FIG. 14. FIG. 19A is a circuit diagram of a counter that produces counter outputs C₀ to C₉ ; FIG. 19B is a circuit diagram of a counter that produces counter output C₁₀ ; and FIG. 19C is a circuit diagram of a counter that produces counter output C₁₁.

As shown in FIG. 19A, the counter 230₀, which is supplied with counter transfer signal CTRS (BCTRS), supplies counter output C₀ (BC₀) based on the signal CTRS (BCTRS). The counter 230₁₀, which is supplied with counter output C₀ (BC₀), supplies counter output C₁ (BC₁) based on counter output C₀ (BC₀). Subsequent counters are connected the same way, and the counter 230₁ is supplied with counter output C₉ (BC₉) as shown in FIGS. 19B and 19C. The counter 230₁₀ supplies counter output C₁₀ (BC₁₀) based on counter output C₉ (BC₉). The counter 230₁₁, which is supplied with counter output C₁₀ (BC₁₀), supplies counter output C₁₁ (BC₁₁) based on counter output C₁₀ (BC₁₀). Among counters 230₀ to 230₁₁, 231₁₀ and 230₁₁ have the circuit arrangement of FIGS. 19B and 19C in order to cope with a change in the number of X-addresses due to the modification of refresh cycle. Specifically, the counter 230₁₀ contains a clocked inverter 232₁₀ that is turned on or off based on the switching signal BR1K, the inversion in signal level of the switching signal R1K. The counter 230₁₁ contains a clocked inverter 232₁₁ that is turned on or off based on the switching signal R4K. Thus, depending on the switching signals R1K and R4K, the counters 232₁₀ and 232₁₁ supply the counter signal or not.

with the counters 232₁₀ and 232₁₁ of the aforesaid construction, when the switching signal R1K is in the H-level and the switching signal R4K is in the L-level (in the case of the 1-kcycle-refresh product), the counters 232₁₀ and 232₁₁ will not produce counter outputs C₁₀ and C₁₁.

When the switching signal R1K is in the L-level and the switching signal R4K is in the L-level (in the case of the 2-kcycle refresh product), the counter 232₁₀ will produce counter output C₁₀, and the counter 232₁₁ will not produce counter output C₁₁.

When the switching signal R1K is in the L-level and the switching signal R4K is in the H-level (in the case of the 4-kcycle refresh product), the counters 232₁₀ and 232₁₁ will produce counter outputs C₁₀ and C₁₁.

FIG. 20 is a circuit diagram of the word-line boosting section 41 of FIG. 14.

As shown in FIG. 20, the word-line boosting section 41 is supplied with the first and second switching signals R1K and R2K. The boosting section 41 supplies the boosting capacitance WKM based on the signal φWL commanding the boosting start. This section 41 contains a NOR gate 234 and NAND gates 236 and 238. The NOR gate 234 has a first input supplied with the switching signal R1K, and a second input with the switching signal R2K. The NAND gate 236 has a first input supplied with the signal R1K, and a second input with the signal φWL. The NAND gate 238 has a first input supplied with the inversion in signal level of the output of NOR gate 234, and a second input with the signal φWL.

With the word-line boosting section 41 of the above-described construction, when the switching signal R1K is in the H-level and the switching signal R2K is in the H-level (in the case of the 1-kcycle-refresh product), bringing signal φWL into the H-level allows one electrode of a first capacitor 240₁ to go to the H-level. Similarly, one electrode of each of a second and third capacitors 240₂ and 240₃ also. goes to the H-level. Therefore, in the 1-kcycle-refresh product, the boosting capacitance potential WKM is produced by using capacitors 240₁ to 240₃.

When the switching signal R1K is in the L-level and the switching signal R2K is in the H-level (in the case of the 2-kcycle-refresh product), bringing signal φWL into the H-level allows one electrode of the first capacitor 240₁ to go to the L-level, and one electrode of each of the second and third capacitors 240₂ and 240₃ to go,to the H-level. Therefore, in the 2-kcycle-refresh product, the boosting capacitance WKM is produced by using capacitors 240₂ to 240₃.

when the switching signal R1K is in the L-level and the switching signal R2K is in the L-level (in the case of the 4-kcycle-refresh product), bringing signal φ/WL into the H-level allows one electrode of each of the first and second capacitor 240₁ and 240₂ to go to the L-level, and one electrode of the third capacitor 240₃ alone to go to the H-level. Therefore, in the 4-kcycle-refresh product, the boosting capacitance WKM is produced by using capacitor 240₃ only.

FIG. 23 shows how addresses are allocated. FIG. 23A shows the address allocation for the 1-kcycle-refresh product (mode); FIG. 23B for the 2-kcycle-refresh product (mode); and FIG. 23C for the 4-kcycle-refresh product (mode).

FIG. 24 is a block diagram showing the construction of the I/O sense amplifier groups 13₀ to 13₃ of FIG. 1.

As shown in FIG. 24, the I/O sense amplifier groups 13₀ to 13₃ contain sense circuits S and select circuits 300₀₀ to 300₃₁ for selecting sense circuits S. The sense circuits S are supplied with outputs I/O ₀₀ to I/O ₃₁ from the sense amplifiers 11₀ to 11₃. The select circuits 300₀₀ to 300₃₁, which are supplied with signals E and F, produce signals for selecting a desired sense circuit S based on signals E and F. Signal E is the output from the Y2-decoder 23, and signal F is the output of the I/O sense amplifier control circuit 31. The output of the sense circuit S selected by the select circuits 300₀₀ to 300₃₁ is, for example, output data D_(OUT).

The I/O sense amplifier groups 13₀ to 13₃ of the above-described construction has the advantages of decreasing the number of data output lines 302 and simplifying the circuit arrangement of the data input/output system.

FIG. 25 is a block diagram showing another construction of the I/O sense amplifier groups 13₀ to 13₃ of FIG. 1.

As shown in FIG. 25, the I/O sense amplifier groups 13₀ to 13₃ contain sense circuits S and select circuits 300₀ to 300₃ for selecting the I/O sense amplifier groups 13₀ to 13₃. The sense circuits S are supplied with outputs I/O ₀₀ to I/O ₃₁ from the sense amplifiers 11₀ to 11₃. The select circuits 300₀ to 300₃, which are supplied with signal F, produce signals for selecting a desired sense amplifier group 13₀ to 13₃ based on signal F. Signal F is the output of the I/O sense amplifier control circuit 31. The output signal from the sense amplifier group S selected by the select circuits 300₀ to 300₃ is supplied to a multiplexer circuit 304, which selects a desired sense circuit S based on signal E, for example. The signal E is the output of the Y2 decoder 23. The output of the sense circuit S selected by the multiplexer circuit 304 is, for example, output data D_(OUT).

The I/O sense amplifier groups 13₀ to 13₃ of the above-described construction has the advantage of simplifying the circuit arrangement of the I/O sense amplifier groups 13₀ to 13₃.

FIG. 26 is a flowchart of a chip selecting method according to the present invention.

This flowchart is used according to device that determines the product specification with the bonding option shown in FIG. 2.

As shown in FIG. 26, at step 1, a pretreatment wafer process is performed to form DRAM chips (integrated circuit chips) in the wafer. After the DRAM chips have been formed, at step 2, a chip screening test is made to see whether the formed DRAM chips are acceptable or not. After this, a pause test (a data retention test) is carried out to determine how long the memory cell in the DRAM chips can retain the data. At step 3, redundancy fuse-cut is performed to save the chips judged to be unacceptable at the step 2 chip screening test, to some extent (redundancy techniques). At step 4, the wafer undergoes dicing, which divides the wafer into a plurality of DRAM chips. At step 5, the chips are assembled. In this process, each chip is mounted on a bed and the chip's pad is bonded to a lead. At this time, based on the result of the step 2 pause test, bonding is done to select a. refresh-cycle mode. This process is done depending on whether a wire is bonded to the bonding pad P of the receiving section 27 of FIG. 2. This bonding determines, for example, the 2-kcycle-refresh product (mode) or the 4-kcycle-refresh product (mode) semipermanently. Then, the packaging process is carried out to form the final product. After this, at step 6, a final test is performed, and the products that have passed this test are put on the market.

FIG. 27 is another flowchart of a chip screening select method according to the present invention.

This flowchart is used with a device that determines the product specification according to the fuse option shown in FIG. 3.

As shown in FIG. 27, at step 3, redundancy fuse-cutting is done. In this step, refresh-cycle select fuse cutting is also done. In this process, the fuse F of the receiving section 27 of FIG. 3 is blown or not. As with the method of FIG. 26, this fuse cutting determines, for example, the 2-kcycle-refresh product (mode) or the 4-kcycle-refresh product (mode) semipermanently.

Since the chip select method determines the 2-kcycle-refresh product (mode) or the 4-kcycle-refresh product (mode) on the basis of the result of the pause test, even if, for example, chips with memory cells whose pause time is shorter than the design pause time due to variations in the processes, they may be saved as the 4-kcycle-refresh product (mode), thereby improving the product yield.

Even in the course of manufacturing, it is easy to change the product specification from the 2-kcycle-refresh product (mode) to the 4-kcycle one or vice versa, providing flexibility in manufacturing products.

FIG. 28 shows the contents of step 2 in FIGS. 26 and 27 in detail.

As shown in FIG. 28, the tests at step 2 are broadly divided into two tests: a chip screening test and a pause test. Of these tests, the chip screening test is further divided into subtests: for example, an operating current test, a typical voltage test, an cell to cell interference test, and others. Each test has its own optimum refresh-cycle. Therefore, setting the optimum refresh-cycle before each test makes it possible to shorten the test time and improve the select capability, thereby improving the chip select test efficiency.

For example, the operating current test in test item TEST A is made with a 2-kcycle-refresh. With the operating current test with a 2-kcycle-refresh, the chip select conditions can be made more severe than those with a 4-kcycle-refresh, making it possible to select only chips with very high reliability.

The typical voltage test in test item TEST B is carried out with a 4-kcycle-refresh. In the typical voltage test with a 4-kcycle-refresh, the short-circuit of word lines (for example, adjacent word lines) that is unacceptable in the 2-kcycle-refresh product is acceptable in the 4-kcycle-refresh product, thereby increasing the number of acceptable products. When 2-kcycle-refresh products are to be obtained from the lot subjected to this test, however, there is a possibility that unacceptable products may also be included in them. To avoid this problem, the typical voltage test with 2-kcycle refresh should be made. When only 4-kcycle-refresh products are obtained, the typical voltage test with 2-kcycle-refresh may not be performed. In this way, the test may be made with 2-kcycle-refresh or 4-kcycle-refresh as required.

The intercell interference test in test item TEST C is made with the 2-kcycle refresh product. The intercell interference test with a 2-kcycle-refresh allows current to flow to all memory cells in a shorter time than that with 4-kcycle-refresh, thereby shortening the test time.

For the tests not shown in FIG. 28, the respective optimum refresh-cycles are set similarly.

FIG. 29 is a sectional view of the pad P of FIG. 2.

Setting the optimum refresh-cycle for each test can be achieved by simply bringing the probe 28 of the wafer probet into contact with the bonding pad P as shown in FIG. 29, and applying a voltage to the receiving section 27 or not.

The present invention is not limited to the above embodiments, and may be practiced or embodied in still other ways without departing from the spirit or essential character thereof. For example, in the foregoing embodiments, the decision signal SDS to determine the product specification is supplied to the receiving section 27 by means of wire bonding or the cutting of fuse F. Instead of the fuse F, a nonvolatile memory cell may be used to supply the decision signal SDS depending on whether the cell turns on or not.

Also, the package may have an additional pin, to which the signal SDS is supplied, so that the user can select one of the two refresh-cycle modes by supplying the signal SDS to the additional pin, and the other refresh-cycle mode by not supplying the signal SDS signal to the additional pin. Further, the package may have two or more additional pins, to which the signals VR1k, VR2K are supplied, so that the user can select any desired one of three or more refresh-cycle modes by supplying the signal SDS to one or more of the additional pins.

Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, representative devices, and illustrated examples shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. 

What is claimed is:
 1. A chip screening method comprising:a step of testing semiconductor memory chips, the testing step including a screening test for determining whether semiconductor chips are acceptable, and a charge retention test for checking the charge retention of memory cells of said semiconductor memory chips; and a step of setting the product specification of said semiconductor memory chips based on the result of the charge retention test.
 2. A chip screening method according to claim 1, wherein the screening test, which includes a plurality of subtests, optimizes the refresh cycle for each subtest.
 3. A method of manufacturing a semiconductor memory device, the method comprising:a step of forming semiconductor memory circuits, each having memory cells, on a semiconductor wafer; a step of testing said semiconductor memory circuits; a step of separating said semiconductor memory circuits to form memory chips on said semiconductor wafer; and a step of assembling said memory chips, wherein the assembling step includes a step of setting said memory chips to operate in one of a plurality of refresh modes based on the testing of said semiconductor memory circuits, whereby memory chips unsuitable for operation in a first refresh mode as determined during the testing step may be set to operate in a second, different refresh mode during the assembling step.
 4. A method according to claim 3, wherein said semiconductor memory circuits comprise dynamic random access memory (DRAM) circuits.
 5. A method according to claim 3, wherein the testing step comprises:a screening test for determining acceptability of said semiconductor memory circuits; and a charge retention test for determining how long said memory cells of said semiconductor memory circuits retain charge.
 6. A method according to claim 5, wherein the screening test comprises a plurality of subtests and the screening test further comprises:a step of setting said semiconductor memory circuits to operate in a first refresh mode during a first subtest; and a step of setting said semiconductor memory circuits to operate in a second refresh mode during a second subtest.
 7. A method according to claim 3, wherein said one of said plurality of refresh modes is set by bonding a wire to a bonding pad.
 8. A method of manufacturing a semiconductor memory device, the method comprising:a step of forming semiconductor memory circuits, each having memory cells, on a semiconductor wafer; a step of testing said semiconductor memory circuits; a step of setting said memory chips to operate in one of a plurality of refresh modes based on the testing of said semiconductor memory circuits, whereby memory chips unsuitable for operation in a first refresh mode as determined during the testing step may be set to operate in a second, different refresh mode during the assembling step; a step of separating said semiconductor memory circuits to form memory chips on said semiconductor wafer; and a step of assembling said memory chips.
 9. A method according to claim 8, wherein the step of setting said memory chips to operate in one of a plurality of refresh modes comprises cutting a fuse.
 10. A screening method for screening semiconductor devices operable in a plurality of operating modes, the method comprising:a first step of performing a first screening subtest, the first step including a step of setting said semiconductor devices to operate in a first operating mode; and a second step of performing a second screening subtest, the second step including a step of setting said semiconductor devices to operate in a second, different operating mode.
 11. A method according to claim 10, wherein the first screening subtest is an operating current test and the second screening subtest is a voltage test.
 12. A method according to claim 11, wherein the plurality of operating modes are refresh cycles, the first operating mode is a first refresh cycle, and the second operating mode is a second refresh cycle.
 13. A method according to claim 12, wherein the first refresh cycle is a 2-kcycle refresh cycle and the second refresh cycle is a 4-kcycle refresh cycle.
 14. A method according to claim 10, wherein the steps of setting said semiconductor devices to operate in the first and second operating modes comprises bringing a probe into contact with a bonding pad. 